A Quick Tool for Assessing Mechanical Stresses in Adhesives between Chip & Substrate (1054)

Chips are bonded to substrates at elevated temperatures. During cooling, high thermal stresses like shear and peeling stresses can arise in the bond. We present here a simple algorithm for computing these stresses in case that the adhesive glue is very much softer than the adherends. A comparison to an analytic formulation developed by Suhir is presented.