The nanoscale-effect based Melting Point Depression (MPD) effect was studied for Al-Si and Ag-Cu (eutectic composition with 72 wt% silver and 28 wt% Cu) nanolayered brazing fillers separated by AlN diffusion barrier layers (DBLs). The thickness of the brazing filler metals was varied between 2 to 20 nanometers, the thickness of the diffusion barrier layer was kept constant at 10 nm. The multilayers were grown by DC magnetron sputtering by alternate sputtering of the brazing filler and diffusion barrier layers. The aim was to understand the scale effect on the melting temperature for the thin films of the investigated brazing filler metal alloys in a proposed multilayer configuration and to utilise this effect in the joining technology for the lowering of the brazing temperature. A linear decrease of the melting point in function of the inverse thickness was measured for the AlSi brazing filler as predicted by the scaling law. The MPD exceeding 230°C was observed for the very thin Al-Si nanolayers. However, no MPD was achieved for the Ag-Cu nanofiller. In the investigated multilayer configuration, the eutectic Ag-Cu brazing filler separates in two single phases (Ag,Cu) and the local material interfaces Ag/AlN, Cu/AlN are formed. In-situ high temperature X-ray diffraction studies show that while the nanosized Cu layer is completely melted at temperatures below 600°C, the nano Ag doesn’t melt and hinders the MPD of the brazing filler. These results indicated an important effect of the diffusion barrier layer and thus the internal material interfaces on the melting behavior of the brazing filler metal in a nanomultilayer configuration. Thus the DBL material has to be chosen very carefully for the given brazing filler metal.