DEVELOPMENT OF NOVEL INK MATERIALS FOR 3D PRINTING: OVERVIEW OF THE DIMAP PROJECT

Irina Gouzman Nurit Atar Ronen Verker Yacov Carmiel Asaf Bolker Eliana Wallach Eitan Grossman
Space Environment Department, Nuclear Research Center Soreq, Yavne, Israel

Additive manufacturing (AM) enables a new industrial paradigm, such as the rapid distributed manufacturing of complex 3D objects. In order to expand applications of 3D printing, new processes and materials should be developed to enable deposition of a broader range of materials including engineering polymers with diverse characteristics. DIMAP project focuses on the development of new ink materials not available for 3D printing by PolyJet technology. Four different inks are investigated: electrically conductive ink, ceramic ink, lightweight polymeric ink, and high strength polyimide-based ink. The novel inks will be applicable to manufacture two technology demonstrators: the bio-inspired robotic arms developed by Festo (Germany), and the 3D-printable luminaires, including PCB devices, developed by Philips Lighting (Netherlands). The project also includes development of a novel multi-material 3D-printer and safe-by-design approach. The challenges created by applications and materials, and by PolyJet technology requirements are numerous and complex.

Soreq is responsible for the development of the high strength polyimide-based inks. Polyimides (PIs) are very attractive polymers due to the superior properties they possess, including high thermal stability, excellent mechanical properties, radiation resistance, chemical stability, low dielectric constant, and good adhesion strength. However, PIs are not commonly used as inks in AM technology.

During the first stage of the DIMAP project, PI-like ink was developed as environmental friendly solution with low viscosity and high solid content. The solutions were characterized in terms of viscosity, uniformity, surface tension, safety, and jettability. The novel PI-like ink was tested using a Stratasys 3D printer (Connex 500). For the first time, PI-like 3D objects were produced using the PolyJet Technology.

* The DIMAP project has received funding from the European Union’s Horizon 2020 Programme for research and innovation under GA No. 685937.









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