Material & Dimensional Metrology Innovations in the Era of Digital Transformation

The abundance of digital transformation applications around us, from the Internet-of-Things, through autonomous-cars to cloud-computing, are driving semiconductor process and device innovation in ways never before attempted. The process flows of nanometer-scale complex devices that are needed to enable these applications are now dominated by material and dimensional complexity. In the past, device scaling dominated the critical path, but today new materials integrated into ever more complex 3D devices enable the cost, speed and power benefits we all have come to demand. To meet these severe requirements, device manufacturers must measure and control sub-nanometer dimensions and atomic-level material properties.
In this talk, we will discuss how process control requirements have reached the sub-nanometer dimensions, and how new methods are being deployed to enable such tight control. We will provide insight into how optical and X-Ray techniques are strengthening each other’s capabilities to provide complete dimensional and materials metrology solutions.