ISM 2022 (Microscopy)

METHODOLOGY FOR MEASURING THE ELASTIC AND INELASTIC MEAN FREE PATHS FOR SCATTERING OF FAST ELECTRONS IN TECHNOLOGICALLY IMPORTANT THIN-FILM OXIDES

Adham Basha 1 George Levi 1 Yang Li 3 Guy Ankonina 3 Pini Shekhter 2 Lior Kornblum 3 Ilan Goldfarb 1 Amit Kohn 1
1Department of Materials Science and Engineering, Tel Aviv University, Ramat-Aviv, Tel-Aviv, 6997801, Israel
2Center for Nanoscience and Nanotechnology, Tel Aviv University, Ramat-Aviv, Tel-Aviv, 6997801, Israel
3Andrew and Erna Viterbi Faculty of Electrical and Computer Engineering, Technion - Israel Institute of Technology, Haifa, 3200003, Israel

Thin-film oxides are a primary building block in many devices and have a wide range of applications: optoelectronics, spin-electronics, energy harvesting and storage, memristive devices, and optical coatings [1].

Transmission Electron Microscopy (TEM) is a widely implemented tool for the characterization of such thin films. Quantitative TEM often requires accurate knowledge of sample thickness for determining properties such as: defect density, structure factors, sample dimensions and geometry. Furthermore, an accurate measurement of sample thickness is necessary for modelling image formation, estimation of electron beam or X-ray signal broadening, and radiation damage evaluation.[2], [3].

The most common indirect thickness measurements using Electron Energy Loss Spectroscopy (EELS) can be applied effectively on both crystalline and amorphous materials [2], [4]–[7]. The drawback is that sample thickness is measured in units of inelastic Mean Free Path (MFP).

The MFP is measured per material and is dependent on several parameters, for example: Energy of the incident electron beam, and collection angle into the spectrometer. Consequently, to date, MFP values are not reported for many technologically important thin-film oxides.

Furthermore, measuring the Elastic MFP is essential for calculating the optimal sample thickness required for quantitative structural characterizations of amorphous materials (e.g., short-range order) [8].

Hence, a versatile and reliable method is required to enable the extraction of inelastic and elastic MFP values of fast electrons, specifically for thin-film oxides.

In this work we demonstrate a fast and precise method for the extraction of MFP values in oxides thin films grown on Si/SiO2 substrates. The method relies on accurate measurement of inelastic MFP values of electrons in crystalline Si using Energy-Filtered TEM thickness mapping and Focused-Ion-Beam perpendicular cross-sectioning. Using this method, elastic and inelastic MFPs of 80keV and 200keV electrons for technologically important oxides were measured: Ta2O5, HfO2, TiO2, Al2O3, ZnO and SiO2 (thermal/CVD/low-κ) – Fig. (1).

Figure 1

References

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